1～7 item / All 7 items
4-inch wafer compatible nano coater (release agent application device)
This device is designed to apply a release agent, rinse clean, and dry the agent on a work surface by processing a maximum 4-inch wafer substrate. The treatment is performed one workpiece at a time. It is a dip coater-type device that reflects the dip coating technology owned by SDI.
Cylindrical work-compatible nano coater (release agent application device)
This device is designed to apply a release agent to the surface of a workpiece by processing a φ200mm nano-in-mold through the steps of release agent application, rinse cleaning, and fixation drying. The processing is done one workpiece at a time. It is a dip coater-type device that reflects the dip coating technology owned by SDI.
Nano coater for metal plate applications (release agent application device)
This device is a dip coater designed for the film formation dip coating of metal plates with a maximum size of 600mm square, automatically performing the processes of high-temperature drying, dipping, firing drying, cleaning, and air drying. It is a dip coater type device that reflects the dip coating technology owned by SDI. For more details, please contact us.
Latest version of the release agent coating device (Nano Incoater)
This device is capable of simultaneously applying release agent and rinsing multiple glass nano-in-molds. It features a tank with a dual-chamber circulation mechanism, enabling automated control of various process patterns.
It is possible to apply up to three types of coating liquids on a single wafer or metal plate with a diameter of φ250 to φ300.
This device is capable of applying up to three types of coating liquids on wafers or metal plates with diameters ranging from φ250 to φ300. Additionally, each tank is easy to replace, making it suitable for applying and evaluating many different coating liquids. An ultrasonic cleaning tank is installed in the first chamber, allowing for operations such as cleaning, coating, and rinsing.
8-inch wafer compatible nano coater (release agent application device)
This device is designed to apply a release agent to a maximum 8-inch wafer through the processes of coating, rinsing, and drying, thereby fixing the release agent to the work surface. The processing is done one workpiece at a time. It is a dip coater-type device that reflects the dip coating technology owned by SDI. *For more details, please download the catalog or contact us.*
![[Free Comprehensive Catalog Gift] Dip Coater, Nano Coater](https://image.mono.ipros.com/public/product/image/018/2000136875/IPROS8384174272242060304.jpg?w=280&h=280)
Desktop dip coater for experiments and development (dip coating device), nano coater (release agent application device), prototypes, mass production, and many others listed!
◆◆Right now, we are offering a free comprehensive catalog.◆◆ We offer a wide range of dip coating technologies for uniform thin film coating at low cost, including dip coaters that can easily (with variable speed) apply coatings and nano coaters that fix release agents. These technologies can be selected according to various applications across many fields. We have a 3D type nano speed dip coater that accommodates various processes, a micro speed dip coater that can form thin films on both sides simultaneously, an integrated device with a BOX that has a gas replacement function with nitrogen and a nano coater, a nano coater (compatible with cylindrical shapes) that fixes release agents on work surfaces, and a cleaning device with an ultrasonic cleaning tank that is ideal for those requiring high cleanliness specifications. We also offer a fully automatic dip coating device that continuously applies, dries, and cools pattern resist as a substitute for dry film on flat copper plates in the printed circuit board manufacturing process. For more details, please download the catalog or contact us.
